Last time, we talked about single-PCB-design panels, all the cool aspects of it, including some cost savings and handling convenience. Naturally, you might wonder, and many did – can you put multiple ...

Multi-material 3D printing is unlocking new design possibilities by integrating diverse properties into a single build. From combining rigidity and flexibility to embedding conductive and insulating ...

The continued unbundling of SoCs into multi-die packages is increasing the complexity of those designs and the amount of design data that needs to be managed, stored, sorted, and analyzed. Simulations ...

Semiconductor design is in the midst of a structural shift. For decades, performance gains were achieved by packing more transistors into single, monolithic dies. But the physical limitations of these ...

What makes up a multi-die/chiplet system? What’s driving demand for multi-die systems? The challenges of multi-die system design. Demands have never been higher for—and on—semiconductors. From smart ...

Katherine Martinko is an expert in sustainable living. She holds a degree in English Literature and History from the University of Toronto. Treehugger often talks about window sizes, dumb boxes, mass ...

Server and computer system architecture has increased in tandem with power delivery (PD) requirements in recent decades. This complicates regulator design since it necessitates a compromise between ...

Nearly all designs at advanced process nodes need some sort of power-saving strategy. As more designs employ advanced low-power techniques, design teams are discovering huge implementation hurdles ...

First, the payload requirements and problems faced by traditional multi-beam antenna are described. The user beam of the VHTS payload system mainly uses Ka-band multi-beam antenna for a large range of ...