PhysicsX’s LGM-Aero AI-based analysis tool predicts performance of new shapes. Credit: PhysicsX Numerical simulation has become an essential part of aircraft design, from aerodynamics and structures ...

The implementation flow for semiconductor devices is all about optimizing for power, performance, area (PPA), or some combination of these attributes. The history of this flow in electronic design ...

Researchers have developed a systematic review that charts the evolution of artificial intelligence in generative design for steel modular structures, particularly steel box modular buildings, ...

As semiconductor components continue to shrink, the challenges associated with design-for-manufacturing (DFM) and design-technology co-optimization (DTCO) increase. The complexity of the IC design and ...

Recent advances in 3D printing combine improved design practices, multi-material capabilities, and groundbreaking material processes to expand functional and industrial applications. Experts highlight ...

Rugged edge computing brand-Cincoze has received a 2026 iF Design Award for the product design and application integration of ...

As enterprise-level web applications become increasingly important to modern business operations, user experience has emerged as a significant consideration ...